Epoxy Adhesive
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Function & Characteristics

UB-3301:Good bonding strength, good hot strength, suitablefor lead-free soldering process, Excellent green strength, low misplacementrate, especially suitable for small

size components high speed mounting. High thixotropic Index and high speed dispensing.

UB-3802:One component,,easy to use and storage, Fast flow without substrate pre-heat productive improvement, rapidlycure, productive improvement, energy saving and low damage to devices.

UB-3426B:One component,no need to mix and easy to use; meet UL 94 V-0 requirement, excllent fire resistance, fast curing,energy saving, and low damage to component

UB-3420:One componentno need to mix and easy to usemeet UL 94 V-0 requirement excllent fire resistancelow temperature curing,energy saving, and low damage to component

UB-3401:One componentno need to mix and easy to usemeet UL 94 V-0 requirement excllent fire resistance;high thermal conductivity and temperature conductivity

Parameters

UB-3301

test standard

data

cosmetic

visual check

red

specific gravity

ASTM B 873

1.15g/ml

thixotropic value

UB-WI-G114

3.19

Glass Transition temperature

 

120℃

Pull-off Strength

 

62

Torque Strength

 

52

 

UB-3802

test standard

data

cosmetic

visual check

black liquid

specific gravity

ASTM B 873

1.12g/ml

thixotropic value

UB-WI-G114

300~600Pa

Glass Transition temperature

ASTM D 3418

100℃

elongation

ASTM D 638

4.6%

cure shrinkage rate

ASTM D 638

1.5%

 

UB-3426B

test standard

data

cosmetic

visual check

black

specific gravity

ASTM B 873

1.55g/ml

hardness

ASTM D 2240

85shoreD

Glass Transition temperature

ASTM D 3418

125℃

elongation

ASTM D 638

2%

cure shrinkage rate

ASTM D 638

1.5%

 

UB-3420

test standard

value

cosmetic

visual check

black

specific gravity

ASTM B 873

1.45g/ml

hardness

ASTM D 2240

85shoreD

Glass Transition temperature

ASTM D 3418

96℃

elongation

ASTM D 638

6.5%

cure shrinkage rate

ASTM D 638

0.1%

 

UB-3401

test standard

data

cosmetic

visual check 

black

specific gravity

ASTM B 873

1.67g/ml

hardness

ASTM D 2240

88shore D

Glass Transition temperature

ASTM D 3418

115℃

elongation

ASTM D 638

0.15%

cure shrinkage rate

ASTM D 638

0.1%

thermal conductivity

ASTM D 2214

1.2W/m·k

 

Product Application

UB-3301 It isspecially designed for bonding SMD to PCB. It particularly designed forhigh speed dispensing processes.

UB-3802 is designed for CSP or BGA underfill. Itis designed to give excellent protection of CSP&BGA solder joints againstmechanical stress, such as drop, shock and vibration. It also protectsBGA&CSP against thermal cycling impact as well

UB-3426B used to COB potting

UB-3420 used for core bonding and electronic parts protection.

UB-3401 Used for the Sealing and adhesive heat exchangedevice, such as generator sets and other general application